Battery Pack Mounting Structure and Electronic Device Having the Same

ABSTRACT

Disclosed is a portable electronic device that includes: a front glass cover that forms a front face of the electronic device; a rear cover that forms a rear face of the electronic device; a side portion that surrounds a space formed by the front glass cover and the rear cover; a display module embedded in the space and including a screen region that is exposed through the front glass cover; a printed circuit board (PCB) interposed between the display module and the rear cover, and including an opening that is at least partially closed; a battery installed within the opening and interposed between the display module and the rear cover; and a power control module (PCM) interposed between the PCB and the display module, and arranged adjacent to a side of the battery when viewed from a position above the PCB.

RELATED APPLICATION(S)

This application claims priority from and the benefit under 35 U.S.C.§119(a) to a U.S. Provisional Patent Application Ser. No. 62/113,108,filed on Feb. 6, 2015, and Korean Patent Application No.10-2015-0060708, filed on Apr. 29, 2015, which are hereby incorporatedby reference for all purposes as if fully set forth herein.

BACKGROUND

Various embodiments of the present disclosure relate to an electronicdevice. For example, various embodiments of the present disclosurerelate to a battery pack mounting structure and an electronic device towhich the battery pack mounting structure is applied.

As the functional differences between electronic devices of respectivemanufacturers have recently been greatly reduced, the electronic devicesare being gradually slimmed in order to satisfy consumers' purchasingneeds. Electronic devices are becoming increasingly more rigid and havestrengthened design features. Various structures (e.g., exteriors) ofthe electronic devices are at least partially implemented by using ametal material so as to appeal to the luxuriousness and elegance of theexteriors of electronic devices.

Further, mounting structures for various accessories, which areessentially arranged within the electronic devices, tend to bediversified in order to maintain the performance of the electronicdevices to be equal to those of the existing electronic devices or tofurther improve the performance of the electronic devices while tryingto slim electronic devices.

A conventional electronic device may be equipped with a simplerectangular battery pack therein. The battery pack may include a batterycell, and may also include a Power Control Module (PCM) unit having auniform thickness above the battery cell. Since the PCM unit is arrangedin parallel to a peripheral printed circuit board (PCB), a correspondingportion of the PCB is cut due to the volume occupied by the PCM unit.Thus, PCB signal wiring space becomes insufficient.

SUMMARY

Various embodiments of the present disclosure may provide a battery packmounting structure and an electronic device, to which the battery packmounting structure is applied.

Various embodiments may provide a battery pack mounting structure thatis implemented such that a PCB wiring space can be enhanced by securingan efficient amount of mounting space for the battery pack, and anelectronic device, to which the battery pack mounting structure isapplied.

Various embodiments may provide a battery pack mounting structure thatis implemented such that a battery cell mounting efficiency can beenhanced by securing an efficient amount of mounting space for thebattery pack, and an electronic device, to which the battery packmounting structure is applied.

According to various embodiments, there is provided a portableelectronic device including: a front glass cover that forms a front faceof the electronic device; a rear cover that forms a rear face of theelectronic device; a side portion that surrounds a space formed by thefront glass cover and the rear cover; a display module positioned in thespace and including a screen region that is exposed through the frontglass cover; a printed circuit board (PCB) interposed between thedisplay module and the rear cover, and including an opening that may beat least partially closed; a battery positioned within the opening andinterposed between the display module and the rear cover; and a powercontrol module (PCM) interposed between the PCB and the display module,and arranged adjacent to a side of the battery when viewed from aposition above the PCB.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more apparent from the following detailed descriptiontaken in conjunction with the accompanying drawings, in which:

FIG. 1 is a view illustrating a network environment including anelectronic device according to various embodiments of the presentdisclosure;

FIG. 2A is a front perspective view of an electronic device according tovarious embodiments of the present disclosure;

FIG. 2B is a rear perspective view of the electronic device according tovarious embodiments of the present disclosure;

FIG. 2C illustrates side, front, bottom and top views of the electronicdevice according to various embodiments of the present disclosure;

FIG. 3 is an exploded perspective view of an electronic device accordingto various embodiments of the present disclosure;

FIG. 4A is a cross-sectional, side view illustrating the electronicdevice according to various embodiments of the present disclosure in anassembled state;

FIG. 4B is a cross-sectional view illustrating a section A of electronicdevice designated in FIG. 4A;

FIG. 5A is a view illustrating a configuration of a battery packaccording to various embodiments of the present disclosure;

FIG. 5B is a view illustrating a configuration in a state where thebattery pack is applied to a housing of an electronic device accordingto various embodiments of the present disclosure;

FIG. 5C is a view illustrating a configuration in a state where thebattery pack is applied to a housing and a PCB of an electronic deviceaccording to various embodiments of the present disclosure;

FIG. 6 is a cross-sectional view illustrating a part of an electronicdevice in a state where a battery pack overlaps with a PCB according tovarious embodiments of the present disclosure;

FIG. 7A is a cross-sectional view illustrating a part of an electronicdevice in which mounting electronic components in relation to thethickness of a battery pack according to various embodiments of thepresent disclosure;

FIG. 7B is a cross-sectional view illustrating a part of an electronicdevice in which mounting electronic components in relation to thethickness of a battery pack according to various embodiments of thepresent disclosure;

FIG. 8A is a top view illustrating a configuration between a PCM unit ofa battery pack and an electronic component according to variousembodiments of the present disclosure;

FIG. 8B is a cross-sectional view along section B-B′ of the arrangementin FIG. 8A illustrating a configuration between a PCM unit of a batterypack and an electronic component according to various embodiments of thepresent disclosure;

FIG. 9 is a view illustrating a configuration between a PCM unit of abattery pack and an electronic component according to variousembodiments of the present disclosure; and

FIGS. 10A and 10B are views illustrating a configuration between a PCMunit of a battery pack and a PCB of an electronic device according tovarious embodiments of the present disclosure.

DETAILED DESCRIPTION

The following description, with reference to the accompanying drawings,is provided to assist in a comprehensive understanding of variousembodiments of the present disclosure as defined by the claims and theirequivalents. It includes various specific details to assist in thatunderstanding but these are to be regarded as merely exemplary.Accordingly, those of ordinary skill in the art will recognize thatvarious changes and modifications of the various embodiments describedherein can be made without departing from the scope and spirit of thepresent disclosure. In addition, descriptions of well-known functionsand constructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are notlimited to the bibliographical meanings, but, are merely used by theinventor to enable a clear and consistent understanding of the presentdisclosure. Accordingly, it should be apparent to those skilled in theart that the following description of various embodiments of the presentdisclosure is provided for illustration purpose only and not for thepurpose of limiting the present disclosure as defined by the appendedclaims and their equivalents.

It is to be understood that the singular forms “a,” “an,” and “the”include plural referents unless the context clearly dictates otherwise.Thus, for example, reference to “a component surface” includes referenceto one or more of such surfaces.

By the term “substantially,” it is meant that the recitedcharacteristic, parameter, or value need not be achieved exactly, butthat deviations or variations, including, for example, tolerances,measurement error, measurement accuracy limitations and other factorsknown to those of skill in the art, may occur in amounts that do notpreclude the effect the characteristic was intended to provide.

The terms “have,” “may have,” “include,” or “may include” as used hereinindicate the presence of disclosed corresponding functions, operations,elements, and the like, and do not limit additional one or morefunctions, operations, elements, and the like. In addition, the terms“include” or “have” indicate the presence of features, numbers,operations, elements, parts, or a combination thereof described in thespecifications, and do not preclude the presence or addition of one ormore other features, numbers, operations, elements, parts, or acombination thereof.

The terms “A or B,” “at least one of A or/and B” or “one or more of Aor/and B” as used herein include any and all combinations of wordsenumerated with it. For example, “A or B,” “at least one of A and B” or“at least one of A or B” describes (1) including A, (2) including B, or(3) including both A and B.

Although terms, such as “first” and “second” as used herein may modifyvarious elements of various embodiments of the present disclosure, theseterms do not limit the corresponding elements. For example, these termsdo not limit an order and/or importance of the corresponding elements.These terms may be used for the purpose of distinguishing one elementfrom another element. For example, a first user device and a second userdevice both indicate user devices and may indicate different userdevices. For example, a first element may be named a second elementwithout departing from the scope of the present disclosure, andsimilarly, a second element may be named a first element.

When an element (e.g., a first element) is “connected to” or“(operatively or communicatively) coupled with/to” another element(e.g., a second element), the first element may be directly connected orcoupled to the second element, and there may be an intervening element(e.g., a third element) between the first element and the secondelement. To the contrary, when an element (e.g., the first element) is“directly connected” or “directly coupled” to another element (e.g., thesecond element), there is no intervening element (e.g., the thirdelement) between the first element and the second element.

The expression “configured to (or set to)” as used herein may bereplaced with “suitable for,” “having the capacity to,” “designed to,”“adapted to,” “made to,” or “capable of” according to the situation. Theterm “configured to (set to)” does not necessarily indicate“specifically designed to” in a hardware level. Instead, the expression“apparatus configured to . . . ” may indicate that the apparatus is“capable of . . . ” along with other devices or parts in a certainsituation. For example, “a processor configured to (set to) perform A,B, and C” may be a dedicated processor, e.g., an embedded processor, forperforming a corresponding operation, or a generic-purpose processor,e.g., a central processing unit (CPU) or an application processor (AP),capable of performing a corresponding operation by executing one or moresoftware programs stored in a memory device.

The terms as used herein are used merely to describe certain embodimentsof the present disclosure and are not intended to limit the presentdisclosure. Further, all the terms used herein, including technical andscientific terms, should be interpreted to have the same meanings ascommonly understood by those skilled in the art to which the presentdisclosure pertains, and should not be interpreted to have ideal orexcessively formal meanings, unless explicitly defined herein.

A module or programming module, according to various embodiments of thepresent disclosure, may further include at least one or more constituentelements among the aforementioned constituent elements, or may omit someof them, or may further include additional constituent elements.Operations performed by a module, programming module, or otherconstituent elements may be executed in a sequential, parallel,repetitive, or heuristic manner. In addition, some of the operations maybe executed in a different order or may be omitted, or other operationsmay be added.

An electronic device, according to various embodiments of the presentdisclosure, may include at least one of a smart phone, a tablet personalcomputer (PC), a mobile phone, a video phone, an e-book reader, adesktop PC, a laptop PC, a netbook computer, a workstation, a server, apersonal digital assistant (PDA), a portable multimedia player (PMP), amoving picture experts group phase 1 or phase 2 (MPEG-1 or MPEG-2) audiolayer 3 (MP3) player, a mobile medical device, a camera, or a wearabledevice (e.g., a head-mounted-device (HMD), an electronic glasses, anelectronic clothing, an electronic bracelet, an electronic necklace, anelectronic appcessory, an electronic tattoo, a smart mirror, a smartwatch, and the like).

An electronic device may also be a smart home appliance. For example,smart home appliances may include at least one of a television (TV), adigital versatile disc (DVD) player, an audio component, a refrigerator,an air conditioner, a vacuum cleaner, an oven, a microwave oven, awashing machine, an air cleaner, a set-top box, a home automationcontrol panel, a security control panel, a TV box (e.g., SamsungHomeSync®, Apple TV®, or Google TV), a game console (e.g., Xbox®PlayStation®), an electronic dictionary, an electronic key, a camcorder,an electronic frame, and the like.

An electronic device may also include at least one of a medicalequipment (e.g., a mobile medical device (e.g., a blood glucosemonitoring device, a heart rate monitor, a blood pressure monitoringdevice, a temperature meter, and the like), a magnetic resonanceangiography (MRA) machine, a magnetic resonance imaging (MRI) machine, acomputed tomography (CT) scanner, an ultrasound machine, and the like),a navigation device, a global positioning system (GPS) receiver, anevent data recorder (EDR), a flight data recorder (FDR), an in-vehicleinfotainment device, an electronic equipment for a ship (e.g., a shipnavigation equipment and/or a gyrocompass), an avionics equipment, asecurity equipment, a head unit for vehicle, an industrial or homerobot, an automatic teller machine (ATM), point of sale (POS) device, oran internet of things device (e.g., a light bulb, various sensors, anelectronic meter, a gas meter, a sprinkler, a fire alarm, a thermostat,a streetlamp, a toaster, a sporting equipment, a hot-water tank, aheater, a boiler, and the like)

An electronic device may also include at least one of a piece offurniture or a building/structure, an electronic board, an electronicsignature receiving device, a projector, and various measuringinstruments (e.g., a water meter, an electricity meter, a gas meter, awave meter, and the like).

An electronic device may also include a combination of one or more ofthe above-mentioned devices. Further, it will be apparent to thoseskilled in the art that an electronic device is not limited to theabove-mentioned examples.

Herein, the term “user” may indicate a person who uses an electronicdevice or a device (e.g., an artificial intelligence electronic device)that uses the electronic device.

An electronic device of a single radio environment can provide long-termevolution (LTE) service using circuit switched fall back (CSFB) whichdetermines whether paging information of a circuit switched (CS) servicenetwork is received over an LTE network. When receiving a paging signalof the CS service network over the LTE network, the electronic deviceconnects (or accesses) the CS service network (e.g., a 2nd generation(2G)/3rd generation (3G) network) and provides a voice call service. Forexample, the 2G network can include one or more of a global system formobile communications (GSM) network and a code division multiple access(CDMA) network. The 3G network can include one or more of awideband-CDMA (WCDMA) network, a time division-synchronous CDMA(TD-SCDMA) network, and an evolution-data optimized (EV-DO) network.

Alternatively, the electronic device of the single radio environment canprovide LTE service using single radio LTE (SRLTE) which determineswhether the paging information is received by periodically switchingevery radio resource (e.g., receive antennas) to the CS service network(e.g., the 2G/3G network). Upon receiving the paging signal of the CSservice network, the electronic device provides the voice call serviceby connecting the CS service network (e.g., the 2G/3G network).

Alternatively, the electronic device of the single radio environment canprovide LTE service using single radio dual system (SRDS), whichdetermines whether the paging information is received by periodicallyswitching some of radio resources (e.g., receive antennas) to the CSservice network (e.g., the 2G/3G network). Upon receiving the pagingsignal of the CS service network, the electronic device provides thevoice call service by connecting the CS service network (e.g., the 2G/3Gnetwork).

FIG. 1 is a block diagram of a configuration of a network environmentincluding an electronic device according to various embodiments of thepresent disclosure.

Referring to FIG. 1, an electronic device 101 includes a bus 110, aprocessor 120, a memory 130, an input/output interface 150, a display160, and a communication interface 170. In various embodiments of thepresent disclosure, the electronic device 100 can omit at least one ofthe components or further include another component.

The bus 110 includes a circuit for connecting the components (e.g., theprocessor 120, the memory 130, the input/output interface 150, thedisplay 160, and the communication interface 170) and deliveringcommunications (e.g., a control message) therebetween.

The processor 120 includes one or more of a CPU, an AP, and acommunication processor (CP). The processor 120 processes an operationor data on control of and/or communication with another component of theelectronic device 101.

The processor 120, which may be connected to the LTE network, determineswhether a call is connected over the CS service network using calleridentification information (e.g., a caller phone number) of the CSservice network (e.g., the 2G/3G network). For example, the processor120 may receive incoming call information (e.g., a CS notificationmessage or a paging request message) of the CS service network over theLTE network (e.g., CSFB). For example, the processor 120 being connectedto the LTE network may receive incoming call information (e.g., a pagingrequest message) over the CS service network (e.g., SRLTE).

When receiving the incoming call information (e.g., a CS notificationmessage or a paging request message) of the CS service network over theLTE network, the processor 120 may obtain caller identificationinformation from the incoming call information. The processor 120displays the caller identification information on its display 160. Theprocessor 120 may determine whether to connect the call based on inputinformation corresponding to the caller identification informationdisplayed on the display 160. For example, when detecting inputinformation corresponding to an incoming call rejection, through theinput/output interface 150, the processor 120 may restrict the voicecall connection and maintains the LTE network connection. For example,when detecting input information corresponding to an incoming callacceptance, through the input/output interface 150, the processor 120connects the voice call by connecting to the CS service network.

When receiving the incoming call information (e.g., a CS notificationmessage or a paging request message) of the CS service network over theLTE network, the processor 120 may obtain caller identificationinformation from the incoming call information. The processor 120 maydetermine whether to connect the call by comparing the calleridentification information with a reception control list. For example,when the caller identification information is included in a firstreception control list (e.g., a blacklist), the processor 120 mayrestrict the voice call connection and maintains the connection to theLTE network. For example, when the caller identification information isnot included in the first reception control list (e.g., the blacklist),the processor 120 may connect the voice call by connecting to the CSservice network. For example, when the caller identification informationis included in a second reception control list (e.g., a white list), theprocessor 120 connects the voice call by connecting to the CS servicenetwork.

When receiving the incoming call information (e.g., a paging requestmessage) of the CS service network over the LTE network, the processor120 may transmit an incoming call response message (e.g., a pagingresponse message) to the CS service network. The processor 120 maysuspend the LTE service and receives the caller identificationinformation (e.g., a CS call (CC) setup message) from the CS servicenetwork. The processor 120 may determine whether to connect the call bycomparing the caller identification information with the receptioncontrol list. For example, when the caller identification information isincluded in the first reception control list (e.g., the blacklist), theprocessor 120 may restrict the voice call connection and resumes the LTEnetwork connection. For example, when the caller identificationinformation is not included in the first reception control list (e.g.,the blacklist), the processor 120 may connect the voice call byconnecting to the CS service network. For example, when the calleridentification information is included in the second reception controllist (e.g., the white list), the processor 120 connects the voice callby connecting to the CS service network.

The memory 130 can include volatile and/or nonvolatile memory. Thememory 130 may store commands or data (e.g., the reception control list)relating to at least another component of the electronic device 100. Thememory 130 may store software and/or a program 140. The program 140 mayinclude, for example, a kernel 141, middleware 143, an applicationprogramming interface (API) 145, and/or application programs (or“applications”) 147. At least some of the kernel 141, the middleware143, and the API 145 may be referred to as an operating system (OS).

The kernel 141 may control or manage system resources (e.g., the bus110, the processor 120, or the memory 130) used for performing anoperation or function implemented by the other programs (e.g., themiddleware 143, the API 145, or the applications 147). Furthermore, thekernel 141 provides an interface through which the middleware 143, theAPI 145, or the applications 147 may connect the individual elements ofthe electronic device 101 to control or manage the system resources.

The middleware 143 may function as an intermediary for allowing the API145 or the applications 147 to communicate with the kernel 141 toexchange data. In addition, the middleware 143 may process one or moretask requests received from the applications 147 according to prioritiesthereof. For example, the middleware 143 may assign priorities for usingthe system resources (e.g., the bus 110, the processor 120, the memory130, and the like) of the electronic device 100, to at least one of theapplications 147. For example, the middleware 143 may perform schedulingor load balancing on the one or more task requests by processing the oneor more task requests according to the priorities assigned thereto.

The API 145 is an interface through which the applications 147 controlfunctions provided from the kernel 141 or the middleware 143, and mayinclude at least one interface or function (e.g., an instruction) forfile control, window control, image processing, text control, and thelike.

The input/output interface 150 functions as an interface that transfersinstructions or data input from a user or another external device to theother element(s) of the electronic device 101. Furthermore, theinput/output interface 150 outputs the instructions or data receivedfrom the other element(s) of the electronic device 101 to the user or anexternal electronic device (e.g., a first external electronic device102, a second external electronic device 104, or a server 106).

The display 160 may include a liquid crystal display (LCD), a lightemitting diode (LED) display, an organic LED (OLED) display, a microelectro mechanical system (MEMS) display, an electronic paper display,and the like. The display 160 displays various types of content (e.g., atext, images, videos, icons, symbols, and the like) for the user. Thedisplay 160 may include a touch screen and receive, for example, atouch, a gesture, proximity, a hovering input, and the like, using anelectronic pen or the user's body part. The display 160 may display aweb page.

The communication interface 170 can establish a communication betweenthe electronic device 100 and an external electronic device (e.g., afirst external electronic device 102, a second external electronicdevice 104, or a server 106). For example, the communication interface170 can communicate with the first external electronic device 102through a wireless communication or a wired communication 164, and alsocommunicate with the second external electronic device 104, or theserver 106 in connection to a network 162 through wireless communicationor wired communication. For example, the wireless communication canconform to a cellular communication protocol including at least one ofLTE, LTE-advanced (LTE-A), CDMA, WCDMA, universal mobiletelecommunications system (UMTS), wireless broadband (WiBro), and GSM.

The wired communication 164 can include at least one of universal serialbus (USB), high definition multimedia interface (HDMI), recommendedstandard 232 (RS-232), and plain old telephone service (POTS).

The network 162 can include at least one of telecommunications networks,for example, a computer network (e.g., a local area network (LAN) or awide area network (WAN)), the Internet, a telephone network, and thelike.

The electronic device 101 provides the LTE service in the single radioenvironment by use of at least one module functionally or physicallyseparated from the processor 120. Various embodiments of the presentdisclosure will be described with reference to a display that includes abent or curved area and is applied to a housing of an electronic device101, in which a non-metal member and a metal member (e.g., a metalbezel) are formed through dual injection molding, but are not limitedthereto. For example, the display 160 may be applied to a housing, inwhich a metal member or a non-metal member is formed of a singlematerial.

Each of the first external electronic device 102 and the second externalelectronic device 104 may be a type of device that is the same as ordifferent from the electronic device 101. According to an embodiment ofthe present disclosure, the server 106 may include a group of one ormore servers. According to various embodiments of the presentdisclosure, all or some of the operations to be executed by theelectronic device 101 may be executed by another electronic device or aplurality of other electronic devices (e.g., the first externalelectronic device 102, the second external electronic device 104 or theserver 106). According to an embodiment of the present disclosure, inthe case where the electronic device 101 should perform a certainfunction or service automatically or by request, the electronic device101 may request some functions that are associated therewith from theother electronic devices (e.g., the first external electronic device 102and the second external electronic device 104 or the server 106) insteadof or in addition to executing the function or service by itself. Theother electronic devices (e.g., the first external electronic device102, the second external electronic device 104 or the server 106) mayexecute the requested functions or additional functions, and maytransmit the results to the electronic device 101. The electronic device101 may provide the requested functions or services by processing thereceived results as they are or additionally. For this purpose, forexample, a cloud computing technique, a distributed computing technique,or a client-server computing technique may be used.

Various embodiments of the present disclosure will be described withreference to a display that includes a bent or curved area and isapplied to a housing of an electronic device, in which a non-metalmember and a metal member (e.g., a metal bezel) are formed through dualinjection molding, but are not limited thereto. For example, the displaymay be applied to a housing, in which a metal member or a non-metalmember is formed of a single material.

FIG. 2A is a front perspective view of an electronic device according tovarious embodiments of the present disclosure. FIG. 2B is a rearperspective view of an electronic device according to variousembodiments of the present disclosure. FIG. 2C illustrates side, front,bottom and top views of the electronic device according to variousembodiments of the present disclosure.

Referring to FIGS. 2A to 2C, a display 201 may be installed on a frontsurface 2001 of an electronic device 200. A receiver 202 for receiving avoice of a counterpart may be disposed at the upper side of the display201. A microphone device 203 for transmitting a voice of a user of theelectronic device to the counterpart may be disposed at the lower sideof the display 201.

According to an embodiment of the present disclosure, components forperforming various functions of the electronic device 200 may bedisposed around the receiver 202. The components may include at leastone sensor module 204. The sensor module 204 may include at least oneof, for example, an illuminance sensor (e.g., an optical sensor), aproximity sensor (e.g., an optical sensor), an infrared sensor, anultrasonic sensor, and the like. According to an embodiment of thepresent disclosure, the components may include a front camera device205. According to an embodiment of the present disclosure, thecomponents may include an indicator 206 to inform the user of stateinformation of the electronic device 200.

According to various embodiments of the present disclosure, theelectronic device 200 may include a metal bezel 220 as a metal housing.According to an embodiment of the present disclosure, the metal bezel220 may be disposed along the outer periphery of the electronic device200 and may be disposed to extend to at least a part of the rear surfaceof the electronic device 200, which is continuous to the outerperiphery. The metal bezel 220 defines at least a part of the thicknessof the electronic device 200 along the outer periphery of the electronicdevice 200, and may be formed in a closed loop shape. Without beinglimited thereto, however, the metal bezel 220 may be formed in a mannerthat contributes to at least a part of the thickness of the electronicdevice 200.

According to an embodiment of the present disclosure, the metal bezel220 may only be disposed in a part of the outer periphery of theelectronic device 200. According to an embodiment of the presentdisclosure, when the metal bezel 220 may form a part of the housing ofthe electronic device 200 and the remaining portion of the housing maybe formed by a non-metal material. In such a case, the housing may beformed in a manner of insert-molding the non-metal member to the metalbezel 220. The metal bezel 220 may include one or more cut-off portions225 and 226 so that a unit bezel portion separated by the cut-offportions 225 and 226 may be utilized as an antenna radiator.

According to an embodiment of the present disclosure, an upper bezelportion 223 may be configured as a unit bezel portion by one pair ofcut-off portions 225 that are formed at a certain interval. A lowerbezel portion 224 may be configured as a unit bezel portion by one pairof cut-off portions 226 that are formed at a certain interval. Thecut-off portions 225 and 226 may be formed in unison when the non-metalmember is insert-molded to the metal member.

According to various embodiments of the present disclosure, the metalbezel 220 may have a closed loop shape along the outer periphery and maybe disposed in a manner of contributing to the entire thickness of theelectronic device 200. When the electronic device 200 is viewed from thefront side thereof, the metal bezel 220 may include a left bezel portion221, a right bezel portion 222, an upper bezel portion 223, and a lowerbezel portion 224.

According to various embodiments of the present disclosure, on the lowerbezel portion 224 of the electronic device, various electroniccomponents may be disposed. According to an embodiment of the presentdisclosure, a speaker device 208 may be disposed at one side of themicrophone device 203. At the a side of the microphone device 203, aninterface connector port 207 may be disposed to perform a datatransmission/reception function with respect to an external device andto charge the electronic device 200 by receiving an external powerapplied thereto. At a side of the interface connector port 207, an earjack hole 209 may be disposed. All the microphone device 203, thespeaker device 208, the interface connector port 207, and the ear jackhole 209 as described above may be disposed within the area of the unitbezel portion that is formed by one pair of cut-off portions 226disposed in the lower bezel portion 224. Without being limited thereto,however, at least one of the above-described electronic components maybe disposed in the area that includes the cut-off portion 226, or may bedisposed outside the unit bezel portion.

According to various embodiments of the present disclosure, variouselectronic components may also be disposed on the upper bezel portion223 of the electronic device 200. For example, on the upper bezelportion 223, a socket device 216 for insertion of a card-type externaldevice may be disposed. The socket device 216 may accommodate at leastone of an inherent identification (ID) card for the electronic device(e.g., a subscriber identity module (SIM) card or a user identity module(UIM)), and a memory card for extending a storage space. At a side ofthe socket device 216, an infrared sensor module 218 may be disposed. Ata side of the infrared sensor module 218, an auxiliary microphone device217 may be disposed.

According to an embodiment of the present disclosure, all the socketdevices 216, the infrared sensor modules 218, and the auxiliarymicrophone devices 217 may be disposed within the area of the unit bezelportion formed by one pair of cut-off portions 225 that are disposed inthe upper bezel portion 223. Without being limited thereto, however, atleast one of the above-mentioned electronic components may be disposedin the area that includes of the cut-off portion 225, or may disposedoutside the cut-off portion 225.

According to various embodiments of the present disclosure, one or morefirst side key buttons 211 may be disposed on the metal bezel 220 (e.g.,on the left bezel portion 224). For example, one pair of first side keybuttons 211 may be disposed on the left bezel portion 221 to partiallyprotrude to contribute to the execution of a volume up/down function, ascroll function, and the like. One or more side key buttons 212 may bedisposed on the metal bezel 220 (e.g., on the right bezel portion 222).The second side key button 212 may be configured to perform a powerON/OFF function, an electronic device wake-up/sleep function, and thelike.

According to an embodiment of the present disclosure, at least one keybutton 210 may be disposed on a portion of the front surface 2001. Forexample, the key button 210 may perform a home key button function. Afingerprint recognition sensor device may be disposed on the top surfaceof the home key button. The home key button may be configured to performa first function (a home screen return function, a wake-up/sleepfunction, and the like) by physically pressing the home key button, andto perform a second function (e.g., a fingerprint recognition function)by swiping the top surface of the home key button. Although notillustrated, touch pads may be disposed on the left and right of the keybutton 210 so as to perform a touch function.

According to various embodiments of the present disclosure, the frontsurface 2001, in which the display 201 is provided, may include a planarportion 2011, and a left bent portion 2012 and a right bent portion 2013which are formed on the left and right of the planar portion 2011,respectively. According to an embodiment of the present disclosure, thefront surface 2001 of the electronic device 200 may include a displayarea 2011 and the other areas (e.g., a black matrix (BM) area) by usinga single window. The left and right bent portions 2012 and 2013 may beformed to extend in an x-axis direction of the electronic device 200 ofFIG. 2A from the planar portion 2011. According to an embodiment of thepresent disclosure, each of the left and right bent portions 2012 and2013 may be configured as a part of the side surfaces of the electronicdevice 200. In such a case, the left and right bent portions 2012 and2013 may be configured as the side surfaces of the electronic device 200together with the left and right bezel portions 221 and 222 of the metalbezel 220, respectively. Without being limited thereto, however, thefront surface 2001, in which the display 201 is provided, may include atleast one of the left and right bent portions 2012 and 2013. The frontsurface 2001 may be configured to include only the left bent portion2012 along the planar portion 2011, or to include only the right bentportion 2013 along the planar portion 2011.

According to various embodiments of the present disclosure, the frontsurface 2001 may include a flexible display module that is applied to atleast a portion of the window that includes the bent portions 2012 and2013 on the left and right thereof, and the lower side of the window.The area including the flexible display module may be configured as adisplay area 2011. According to an embodiment of the present disclosure,the window may be formed in a manner in which the top and rear surfacesthereof are simultaneously bent (hereinafter, a “three-dimensional (3D)type”). Without being limited thereto, the window may be formed in amanner in which the left and right portions of the top surface areformed in a curved shape and the rear surface is formed in a planarshape (hereinafter, “two-and-a-half dimensional (2.5D) type”). Accordingto an embodiment of the present disclosure, the window may be formed ofa transparent glass material (e.g., a sapphire glass) or a transparentsynthetic resin material.

According to various embodiments of the present disclosure, theelectronic device 200 may control the display module so as toselectively display information. According to an embodiment of thepresent disclosure, the electronic device 200 may control the displaymodule so as to configure a screen only on the planar portion 2011. Forexample, the electronic device 200 may control the display module toconfigure a screen by any one of the left and right bent portions 2012and 2013 together with the planar portion 2011. The electronic device200 may control the display module to configure a screen by at least oneof the left and right bent portions 2012 and 2013, excluding the planarportion 2011.

Referring to FIG. 2B, a rear camera device 213 may be disposed on therear surface 2002 of the electronic device 200, and one or moreelectronic components 214 may be disposed at a side of the rear cameradevice 213. According to an embodiment of the present disclosure, theelectronic components 214 may include at least one of an illuminancesensor (e.g., an optical sensor), a proximity sensor (e.g., an opticalsensor), an infrared sensor, an ultrasonic sensor, a heartrate sensor, aflash device, and the like.

According to various embodiments of the present disclosure, the rearsurface 2002 of the electronic device 200 may also be entirely formed byone window 215. The rear surface 2002 may include a planar portion 2151that is substantially formed in the central portion to be the center,and a left bent portion 2152 and a right bent portion 2153, which areformed on the left and right of the planar portion 2151, respectively.

According to an embodiment of the present disclosure, the window 215 maybe configured in the 2.5D type in which the left and right bent portions2152 and 2153 of the outer surface are formed in a curved shape and therear surface is formed as a planar surface. Without being limitedthereto, however, the window 215 may be formed in the 3D type similar tothe window disposed on the front surface 2001.

According to an embodiment of the present disclosure, each of the leftand right bent portions 2152 and 2153 may be configured as a part of theside surfaces of the electronic device 200. In such a case, the left andright bent portion 2152 and 2153 may be configured as the side surfacesof the electronic device 200 together with the left and right bezelportions 221, 222 of the metal bezel 220. Without being limited thereto,however, the rear surface 2002 may include only at least one of the leftand right bent portions 2152 and 2153. For example, the rear surface2002 may be configured to include only the left bent portion 2152 alongthe planar portion 2151, or to include only the right bent portion 2153along the planar portion 2151.

According to various embodiments of the present disclosure, the upperside left and right corner portions and the lower side left and rightcorner portions of the front surface 2001 may be formed to besimultaneously inclined in the x-axis direction, the y-axis direction,and the z-axis direction in FIG. 2A while the window is bent. With thisshape, the upper side left and right corner portions and the lower sideleft and right corner portions of the metal bezel 220 may be formed suchthat the heights thereof gradually decrease towards the side surfaces,respectively.

While a metal bezel 220, which is configured as a part of the housing ofthe electronic device 200, has been illustrated and described above,various embodiments of the present disclosure are not limited thereto.For example, various metal members disposed on the electronic device 200may be used for various embodiments of the present disclosure.

FIG. 3 is an exploded perspective view of an electronic device accordingto various embodiments of the present disclosure. Hereinafter, theelectronic device illustrated in FIG. 3 may be an electronic devicewhich is the same as the above-described electronic device 200.

Referring to FIG. 3, an electronic device 300 may include a printedcircuit board (PCB) 360, a bracket 320, a display module 330, and afront window 340, which may be disposed in a manner of beingsequentially stacked on the upper side of the housing 310. According toan embodiment of the present disclosure, the electronic device mayinclude a wireless power transmission/reception member 380 and a rearwindow 350, which may be disposed in a manner of being sequentiallystacked on the lower side of the housing 310.

According to an embodiment of the present disclosure, the battery pack370 is accommodated in an accommodation space 311 of the battery pack370, which is formed in the housing 310, and may be disposed to avoidthe PCB 360. The battery pack 370 and the PCB 360 may be disposed inparallel and not to overlap with each other. The display module 330 maybe fixed to the bracket 320, and the front window 340 may be fixed bybeing attached to the bracket 320 by a first adhesive member 391. Therear window 350 may be fixed by being attached to the housing 310 by asecond adhesive member 392.

According to various embodiments of the present disclosure, the frontwindow 340 may include a planar portion 3401, and a left bent portion3402 and a right bent portion 3403, which are bent in oppositedirections from the planar portion 3401. The front window 340 may bepositioned on the electronic device 300 so as to form the front surface,and is formed of a transparent material so as to display a screenpresented by the display module 330 and to provide an input/outputwindow for various sensors. While the shape the left and right bentportions 3402 and 3403 are illustrated as formed in the 3D type, a shapein which the upper and lower portions as well as the left and rightportions are single-bent, or a shape in which the upper, lower, left,and right portions are dual-bent, may be applied. A touch panel may befurther disposed on the rear surface of the front window 340 and mayreceive a touch input signal from the outside.

According to various embodiments of the present disclosure, the displaymodule 330 may also be formed in a shape corresponding to that of thefront window 340 (a shape having a curvature corresponding to that ofthe front window 340). According to an embodiment of the presentdisclosure, the display module 330 may include a planar portion 3301,and left and right bent portions 3302 and 3303 on the left and right ofthe planar portion 3301. A flexible display module may be used as thedisplay module 330. In the case of a window of a type where the rearsurface of the front window 340 is formed in a planar shape(hereinafter, 2D type or 2.5 D type), and the rear surface of the frontwindow 340 is planar, an ordinary LCD or an on-cell touch screen panel(TSP) active matrix OLED (AMOLED) (OCTA) may be applied.

According to various embodiments of the present disclosure, the firstadhesive member 391 is a component for fixing the front window 340 to abracket 320 that is disposed within the electronic device 300, and maybe a kind of tape, such as a double-sided tape, or a liquid adhesivelayer, such as a bond. According to an embodiment of the presentdisclosure, when the double-sided tape is applied as the first adhesivemember 391, a general polyethylene terephthalate (PET) or a functionalbase may be applied as the internal base of the adhesive member 391. Forexample, by using a base formed of a foam type or shock-resistive fabricmaterial so as to reinforce the shock resistance, it is possible toprevent the front window 340 from being destroyed by external impact.

According to various embodiments of the present disclosure, the bracket320 may be used as a component for reinforcing the entire rigidity ofthe electronic device 300 by being disposed within the electronic device300. According to an embodiment of the present disclosure, the bracket320 may be formed of at least one metal selected from aluminum (Al),magnesium (Mg), and sterling silver (STS). For example, the bracket 320may be formed of a highly rigid plastic, in which glass fibers arecontained, or may be formed of a combination of a metal and a plastic.When a metal member and a non-metal member are used in combination, thebracket 320 may be formed by insert-molding the non-metal member to themetal member. The bracket 320 may be placed on the rear surface of thedisplay module 330. The bracket 320 may have a shape (curvature) that issimilar to the shape of the rear surface of the display module 330 andmay support the display module 330.

According to an embodiment of the present disclosure, between thebracket 320 and the display module 330, an elastic member, such as asponge or a rubber, and an adhesive layer, such as a double-sided tapeor a single, sheet layer (e.g., such as a single-sided tape), may beadditionally disposed so as to protect the display module 330. A sectionof the bracket 320 may further include a slot-sinking or hole area 321for securing a component mounting space or include added (e.g., aswelling gap) to accommodate a change of a component during use, such asthe swelling of the battery pack 370. According to an embodiment of thepresent disclosure, a sheet-type metal or composite material may beadded to the corresponding hole area 321 so as to reinforce the internalrigidity, or as an auxiliary device for improving a thermalcharacteristic, an antenna characteristic, and the like. According to anembodiment of the present disclosure, the bracket 320 may be fastened tothe housing 310 (e.g., the rear case) so as to form a space therein, andat least one electronic component may be disposed in such a space.

According to various embodiments of the present disclosure, the at leastone electronic component may include a PCB 360. Without being limitedthereto, however, the at least one electronic component may include anantenna device, a sound device, a power supply device, a sensor device,and the like in addition to the PCB 360.

According to various embodiments of the present disclosure, the batterypack 370 may supply power to the electronic device 300. According to anembodiment of the present disclosure, one surface of the battery pack370 may be close to the display module 330 and the other surface may beclose to the rear window 350 if the battery pack 370 swells duringcharge, counterpart objects may be deformed or destroyed. In order toprevent this, a space (e.g., swelling gap) may be provided between thebattery pack 370 and the counterpart objects (e.g., the display module330 and the rear window 350) so as to protect the counterpart objectsfrom deformation or destruction. According to an embodiment of thepresent disclosure, the battery pack 370 may be integrated with theelectronic device 300. Without being limited thereto, however, when therear window 350 is implemented to be attachable to/detachable from theelectronic device 300, the battery pack 370 may be implemented to beattachable/detachable.

According to various embodiments of the present disclosure, the housing310 forms the exterior of the electronic device 300 (e.g., side surfacesincluding a metal bezel (e.g., metal bezel 220)), and may be coupled tothe bracket 320 so as to form an internal space. According to anembodiment of the present disclosure, a front window 340 may be disposedon the front surface of the housing 310, and a rear window 350 may bedisposed on the rear surface of the housing 310. Without being limitedthereto, however, the rear surface of the housing 310 may be variouslyimplemented by molding a synthetic resin, or by using a metal, acomposite of a metal and a synthetic resin, and the like. For example,an inter-structure gap formed by the housing 310 and the rear window 350may prevent the destruction of the rear window 350 from the secondaryimpact by an internal structure when an external impact occurs, such asthe drop of the electronic device 300 to the ground.

According to various embodiments of the present disclosure, a wirelesspower transmission/reception member 380 may be disposed on the rearsurface of the housing 310. According to an embodiment of the presentdisclosure, the wireless power transmission/reception member 380 mainlyhas a thin film form and is disposed by being attached to one surface ofan internally mounted component or an area of the inner surface of thehousing 310, in particular to an area that is generally close to therear window 350. The wireless power transmission/reception member 380may include a structure that forms a contact with the PCB 360 within thehousing 310. According to an embodiment of the present disclosure, thewireless power transmission/reception member 380 may be embedded orattached as a component of the battery pack 370, and the like, or a partof the housing 310, and may be provided in the form of being attached tomore than one structure (e.g., attached to both of a component and thehousing 310).

According to various embodiments of the present disclosure, the secondadhesive member 392 is a component that fixes the rear window 350 to thehousing 310 and may be applied in a form similar to that of the firstadhesive member 391 described above.

According to various embodiments of the present disclosure, the rearwindow 350 may be applied in a form similar to that of the front window340. According to an embodiment of the present disclosure, the frontsurface (the surface exposed to the outside) of the rear window 350 maybe formed in a curvature that is more inclined as going to both of theleft and right ends. The rear surface of the rear window 350 may beformed in a planar surface to be attached to the housing 310 by thesecond adhesive member 392.

FIG. 4A is a cross-sectional, side view illustrating an electronicdevice in the assembled state according to various embodiments of thepresent disclosure. FIG. 4B is a cross-sectional view illustrating asection A of electronic device designated in FIG. 4A according tovarious embodiments of the present disclosure.

Referring to FIGS. 4A and 4B, the electronic device 200 may include abracket 320 that may be fixed to the housing 310. According to anembodiment of the present disclosure, the housing 310 may be formed byinjection-molding a non-metal member (e.g., polycarbonate) 313 to themetal bezel 312. According to an embodiment of the present disclosure,the display module 330 may be fixed to the front surface of the bracket320, and the front window 340 may be disposed on the display module 330.The front window 340 may be fixed by being attached to the bracket 320by the first adhesive member 391 adjacent to an end of the housing 310.

According to an embodiment of the present disclosure, the front window340 may be fixed by being attached to the bracket 320 by the firstadhesive member 391 to correspond to the shape thereof on the end of thehousing 310. According to an embodiment of the present disclosure, thefront window 340 may be fixed by being attached to the bracket 320 bythe first adhesive member 391 while being supported by the end of thehousing 310. According to an embodiment of the present disclosure, thefront window 340 may have a uniform thickness and may be formed in ashape having a certain curvature. According to an embodiment of thepresent disclosure, all of the planar portion and the left and rightbent portions of the front window 340 may be formed to have a uniform orvarying thickness.

According to various embodiments of the present disclosure, the rearwindow 350 may also be fixed to the housing 310 by the second adhesivemember 392. According to an embodiment of the present disclosure, therear window 350 may be formed to have a thickness that is reducedtowards the left and right edges (a shape which is formed in the 2.5Dtype).

According to various embodiments of the present disclosure, in the spacebetween the bracket 320 and the housing 310, an electronic component,such as the PCB 360, may be accommodated, and the battery pack 370 maybe disposed in parallel with the PCB 360 to avoid the PCB 360.

FIG. 5A is a view illustrating a configuration of a battery packaccording to various embodiments of the present disclosure.

Referring to FIG. 5A, a battery pack 1200 includes a battery cell 1210,a power control module (PCM) unit 1230 disposed on a side area of theupper side of the battery cell 1210, and a connection terminal portion1231 that is drawn out from the PCM unit 1230 and electrically connectedto a PCB (e.g., PCB 360) of an electronic device. According to anembodiment of the present disclosure, the PCM unit 1230 may be installedon a pouch terrace 1220 that is disposed on the upper portion of thebattery cell 1210. According to an embodiment of the present disclosure,the battery pack 1200 may be configured as a battery pack that isembedded (e.g., integrally) in an embodiment of the electronic device.

According to various embodiments of the present disclosure, the PCM unit1230 may perform functions of detecting (when the voltage of the batterypack 1200 increases due to a charge voltage and a charge current thatare input from the outside) a battery voltage, and cutting off andreleasing the charge current such that the battery is not charged to alevel that is equal to or higher than an over-charge voltage set. ThePCM unit 1230 may perform a function of detecting (when the voltage ofthe battery is gradually discharged due to the current consumed to theoutside) the battery voltage, and cutting off and releasing thedischarge current such that the battery is not discharged to a levelthat is equal to or lower than an over-discharge voltage set in themodule. The PCM unit 1230 may perform a function of cutting off andreleasing a charge or discharge current such that the current is chargedor discharged to a level that is equal to or higher than an over-currentset due to an abnormal phenomenon of an electronic device or a chargedevice.

According to an embodiment of the present disclosure, when plus (+) andminus (−) terminals are short-circuited in the outside of the batterypack 1200, a current of about 20 times the capacity of the battery pack1200 flows instantly. The PCM unit 1230 may perform functions ofpreventing an accident and protecting the battery pack 1200 by cuttingoff the current.

While a battery pack 1200 is disposed in parallel with a PCB (e.g., PCB360) in an electronic device (for example, disposed in parallel with theexterior of the battery pack), a restriction may be 1200 by the PCM unit1230 that is uniformly disposed on the upper portion of the battery pack1200. For example, due to the shape of the rectangular battery pack1200, the battery pack 1200 may occupy a large space in the entirelength direction of the PCM unit 1230. Accordingly, it is necessary tomake the arrangement of the PCM unit 1230 of the battery pack 1200variable so as to maximize a space efficiency according to the mountingof the battery pack 1200, thereby contributing to the slimming of theelectronic device.

FIG. 5B is a configuration view illustrating a state in which batterypack is applied to a housing of an electronic device according tovarious embodiments of the present disclosure. FIG. 5C is aconfiguration view illustrating a state in which a battery pack isapplied to a housing and a PCB of an electronic device according tovarious embodiments of the present disclosure.

Referring to FIGS. 5B and 5C, the battery pack 1200 may be mounted inthe housing 1251 of the electronic device 1250. According to anembodiment of the present disclosure, the PCM unit 1230 of the batterypack 1200 may be formed to be biased to one side in the entire lengthdirection, and an electronic component 1240 may be disposed in the areawhere the PCM unit 1230 is not disposed. For example, the PCM unit 1230may be disposed at a position where it is overlapped or partiallyoverlapped with the PCB 1260 of the electronic device 1250. The PCM unit1230 may be disposed at a position where it is overlapped (or at leastpartially overlapped) with the PCB 1260 and to avoid the electroniccomponent 1240 that is mounted on and protrude from the PCB 1260. Forexample, the PCM unit 1230 may protrude from at least a portion of thebattery pack 1200 such that at least the portion is arranged topartially overlap with the PCB in a first face of the PCB 1260. At leastone electronic component that is mounted on a second face of the PCB1260 which is opposite to the first face of the PCB 1260 to at leastpartially overlap with the PCM unit 1230. The electronic component 1240may include a component that is mounted on and protrudes from the PCB1260, such as a memory, a processor, various elements, a camera device,various sensor modules (e.g., a heart rate monitor (HRM) sensor module),a flash, and the like.

FIG. 6 is a cross-sectional view illustrating a portion of an electronicdevice in a state where a battery pack and a PCB are overlapped witheach other according to various embodiments of the present disclosure.

Referring to FIG. 6, the electronic device 1250 may include the batterypack 1200 mounted therein. According to an embodiment of the presentdisclosure, the battery cell 1210 of the battery pack 1200 may bemounted in parallel with the PCB 1260 of the electronic device 1250 toavoid the PCB 1260. The battery pack 1200 may be configured such thatthe PCM unit 1230 is drawn out by a certain length, and may be disposedsuch that at least a part of the PCM unit 1230 is overlapped with thePCB 1260.

According to various embodiments of the present disclosure, the PCM unit1230 may be disposed below or on the bottom of the PCB 1260, and variouselectronic components 1240 and 1242 may be disposed above or on the topof the PCB 1260. The electronic component may be at least one of amemory, a processor, various elements, a camera device, various sensormodules, and a flash device. By disposing the PCM unit 1230 to overlapwith the PCB 1260 within the area of the PCB 1260 adjacent to thebattery pack 1200 and within the thickness of the battery pack 1200, thewindow 1254 that includes the display 1253 and the bracket 1252, thatsupports the display 1253, may be at least partially accommodated.

FIGS. 7A and 7B are cross-sectional views illustrating a portion of anelectronic device, in which methods of mounting electronic components inrelation to a thickness of a battery pack are illustrated according tovarious embodiments of the present disclosure.

Referring to FIGS. 7A and 7B, in the entire thickness ‘w’ of the batterypack 1200, the remaining thicknesses w1 and w2, except the thickness ofthe PCM unit 1230, may be used as mounting spaces for various electroniccomponents 1240, 1242, and 1255, including the PCB 1260 of theelectronic device (see, e.g., FIG. 6).

According to various embodiments of the present disclosure, in the upperarea of the PCM unit 1230, the PCB 1260 and electronic components 1240and 1243, such as a memory, a processor, various elements, a cameradevice, various sensor module, and a flash device, which are mountedabove or on the top of the PCB 1260, may be disposed. In the entirethickness ‘w’ of the battery pack 1200, the upper thickness w1, exceptthe thickness of the PCM unit 1230, may provide at least a part of aspace, in which the PCB 1260 and electronic components 1240 and 1242,such as a memory, a processor, various elements, a camera device,various sensor module, and a flash device, which are mounted on the topof the PCB 1260, may be applied. According to an embodiment of thepresent disclosure, in the thickness ‘w’ of the battery pack 1200, thelower thickness w2, except the thickness of the PCM unit 1230, mayprovide at least a part of a space, in which an electronic component forthe display 1253 and the bracket 1252 for supporting the display 1253,are applied.

FIG. 8 is a view illustrating a disposed relationship between a PCM unitof a battery pack and electronic components according to variousembodiments of the present disclosure. Specifically, FIG. 8A is a topview illustrating a configuration between a PCM unit of a battery packand an electronic component according to various embodiments of thepresent disclosure. FIG. 8B is a cross-sectional view along section B-B′of the arrangement in FIG. 8A illustrating a configuration between a PCMunit of a battery pack and an electronic component according to variousembodiments of the present disclosure.

Referring to FIGS. 8A and 8B, when a sensor module and a flash device1542 are arranged below a camera module 1540 as the electroniccomponents, the battery cell 1510 of the battery pack 1500 may bedisposed in parallel with the PCB 1560 and the camera module 1540mounted above or on the PCB 1560. According to an embodiment of thepresent disclosure, the PCM unit 1530 of the battery pack 1500 may bedisposed to overlap with the sensor module and the flash device 1542which are mounted on the PCB 1560. The sensor module and the flashdevice 1542 may be mounted above or on the top of the PCB 1560, and thePCM unit 1530 of the battery pack 1500 may be disposed below or on thebottom of the PCB 1560 to overlap with the sensor module and the flashdevice 1542. Accordingly, as compared to an existing mounting structurein which the battery pack 1500 is disposed in parallel with the PCB1560, it is possible to secure a component mounting space or to increasethe size/capacity of the battery cell 1510.

FIG. 9 is a configuration view illustrating a disposed relationshipbetween a PCM unit of a battery pack and an electronic componentaccording to various embodiments of the present disclosure.

Referring to FIG. 9, a battery cell 1610 of a battery pack 1600 may bemounted to avoid a PCB 1660. For example, the battery cell 1610 may bedisposed at least on the same plane as the PCB 1660. However, a PCM unit1630, which is disposed to be weighted to the upper side of the batterycell 1610, may be disposed to be at least partially overlapped with andto be electrically connected to the PCB 1660. PCM unit 1630 may bearranged on a face that is equal to a face of the PCB on which theelectronic component is mounted. The PCM unit 1630 is mounted on a facethat is opposite to a face of the PCB 1660 on which the electroniccomponent is mounted. In addition, on the PCB 1660, an electroniccomponent such as a socket device 1670 may be mounted in or around anarea in which the PCM unit 1630 of the battery pack 1600 is disposed.According to an embodiment of the present disclosure, the socket device1670 may accommodate a card-type external device (e.g., a SIM card, aUIM card, a card-type memory, and the like).

According to various embodiments of the present disclosure, the PCM unit1630 of the battery pack 1600 is disposed to overlap with the topportion of the PCB 1660, and the socket device is disposed in parallelwith the PCM unit 1630 at a side of the PCM unit 1630 so that the wiringspace shortage of the PCB 1660, which is caused due to the PCM unit 1630of the battery pack 1600, can be addressed.

FIGS. 10A and 10B are configuration views illustrating a disposedrelationship between a PCM unit of a battery pack and a PCB of anelectronic device according to various embodiments of the presentdisclosure.

Referring to FIGS. 10A and 10B, a pouch terrace 1730 having a certainwidth and length may be formed on the top of a battery pack 1700.According to an embodiment of the present disclosure, a PCM unit 1731may be disposed at a side of the pouch terrace 1730, and a connectionterminal portion 1732 may be formed to be drawn out by a certain lengthso as to be electrically connected to a PCB 1760 at a side of the pouchterrace 1730. According to an embodiment of the present disclosure, theconnection terminal portion 1732 may be disposed to be individuallydrawn out along the pouch terrace 1730 at a side of the pouch terrace1730, rather than being directly drawn out from the PCM unit 1731.

According to various embodiments of the present disclosure, the PCM unit1731 may be formed to have a relatively small height and disposed inparallel with the PCB 1760, and the connection terminal portion 1732 maybe electrically connected to a side of the PCB 1760 to avoid the cameradevice 1740. Accordingly, the battery pack 1700 is disposed in a statewhere the connection terminal portion 1732 and the PCM unit 1731 areseparated from the battery cell 1710 so that the volume of the PCM unit1731 can be reduced so as to increase the capacity of the battery pack1700 and the area of the PCB 1760 can be increased so as to secure awiring space.

According to various embodiments of the present disclosure, there isprovided a portable electronic device that may include a front glasscover that forms a front surface of the electronic device, a rear coverthat forms a rear surface of the electronic device, a side surface unitthat surrounds a space that is formed by the front glass cover and therear cover, a display module that is positioned or embedded in the spaceand includes a screen area exposed through the front glass cover, a PCBthat may be disposed between the display module and the rear cover, andincludes an opening that may be at least partially closed, a batterythat may be positioned or installed within the opening and interposedbetween the display module and the rear cover, and a PCM that may bepositioned between the PCB and the display module, and may be disposedclose to a side of the battery when viewed from a position above thePCB.

According to various embodiments of the present disclosure, the rearcover and the side surface unit may be formed integrally with eachother.

According to various embodiments of the present disclosure, the rearcover and the side surface unit may include the identical material.According to an embodiment of the present disclosure, the material maybe a metal.

According to various embodiments of the present disclosure, theelectronic device may further include a camera module that may bedisposed close to a side of the battery and a side of the PCM whenviewed from a position above the PCB. The camera module includes aportion interposed between the display module and the rear cover. Thecamera module may include a lens that is exposed through the rear cover.

According to various embodiments of the present disclosure, theelectronic device may further include a camera flash and/or a biometricsensor which may be disposed at the one side of the battery to at leastpartially overlap with the PCM when viewed from a position above thePCB, and are positioned between the PCB and the rear cover.

According to various embodiments of the present disclosure, the PCM andthe camera module may be positioned side by side at a side of thebattery when viewed from a position above the PCB, and at least a partof the camera flash and/or the biometric sensor and the PCM may bepositioned at sides of the PCB, respectively, when viewed from across-section.

According to various embodiments of the present disclosure, theelectronic device may further include a camera module that is formedthrough the PCB and disposed close to the one side of the battery whenviewed from a position above the PCB, and includes a lens exposedthrough the rear cover. The PCM may have an L-shape that includes afirst portion that may be positioned between the camera module and thebattery when viewed from a position above the PCB.

While the present disclosure has been particularly shown and describedwith reference to the examples provided therein, it will be understoodby those skilled in the art that various changes in form and details maybe made therein without departing from the spirit and scope of thepresent disclosure as defined by the appended claims.

What is claimed is:
 1. A portable electronic device comprising: a frontglass cover that forms a front face of the portable electronic device; arear cover that forms a rear face of the portable electronic device; aside portion that surrounds a space formed by the front glass cover andthe rear cover; a display module embedded in the space and including ascreen region that is exposed through the front glass cover; a printedcircuit board (PCB) interposed between the display module and the rearcover, and including an opening that is at least partially closed; abattery installed within the opening and interposed between the displaymodule and the rear cover; and a power control module (PCM) interposedbetween the PCB and the display module, and arranged adjacent to a sideof the battery when viewed from a position above the PCB.
 2. Theportable electronic device of claim 1, wherein the rear cover and theside portion is integrally formed with each other.
 3. The portableelectronic device of claim 2, wherein the rear cover and the sideportion include an identical material.
 4. The portable electronic deviceof claim 3, wherein the material is a metal.
 5. The portable electronicdevice of claim 1, further comprising: a camera module including aportion arranged adjacent to the side of the battery and a side of thePCM when viewed from the position above the PCB, and interposed betweenthe display module and the rear cover, and the camera module includes alens exposed through the rear cover.
 6. The portable electronic deviceof claim 5, further comprising: a camera flash and/or a biometric sensorthat is arranged at the side of the battery and overlaps at leastpartially overlap with the PCM when viewed from the position above thePCB, the camera flash and/or the biometric sensor being interposedbetween the PCB and the rear cover.
 7. The portable electronic device ofclaim 6, wherein the PCM and the camera module are positioned side byside at the side of the battery, and at least a portion of the cameraflash and/or the biometric sensor and the PCM are positioned at oppositesides of the PCB when viewed from a cross-section.
 8. The portableelectronic device of claim 1, further comprising: a camera module thatincludes a lens provided through the PCB and arranged at the side of thebattery when viewed from the position above the PCB, the lens beingexposed through the rear cover, wherein the PCM includes an L-shapeincluding a first portion interposed between the camera module and thebattery when viewed from the position above the PCB.
 9. An electronicdevice comprising: a battery pack including a power control module (PCM)unit arranged to protrude in at least a portion of a battery cell; and aprinted circuit board (PCB) arranged in parallel to the battery cell,the PCM unit is arranged to at least partially overlap the PCB andarranged to avoid at least one electronic component mounted on the PCB.10. The electronic device of claim 9, wherein the PCM unit iselectrically connected to the PCB.
 11. The electronic device of claim 9,wherein the PCM unit is arranged on a face that is equal to a face ofthe PCB on which the electronic component is mounted.
 12. The electronicdevice of claim 9, wherein the PCM unit is mounted on a face that isopposite to a face of the PCB on which the electronic component ismounted.
 13. The electronic device of claim 12, wherein the PCM unit isarranged to at least partially overlap with the electronic componentwhen the PCM unit is arranged on the face that is opposite to the faceof the PCB on which the electronic component is mounted.
 14. Theelectronic device of claim 9, wherein the electronic component is atleast one of a memory, a processor, various elements, a camera device,various sensor modules, and a flash device.
 15. The electronic device ofclaim 9, wherein the battery pack is arranged as an embedded powersource in the electronic device.
 16. An electronic device comprising: abattery pack; a printed circuit board (PCB) that is arranged in parallelto a battery cell of the battery pack; a power control module (PCM) unitthat protrudes from at least a portion of the battery cell such that atleast the portion is arranged to partially overlap with the PCB in afirst surface of the PCB; and at least one electronic component that ismounted on a second surface of the PCB which is opposite to the firstsurface of the PCB to at least partially overlap with the PCM unit. 17.The electronic device of claim 16, wherein the PCM unit, the PCB, andthe at least one electronic component are arranged such that a totalmounting thicknesses thereof is not larger than a thickness of thebattery cell.
 18. The electronic device of claim 16, wherein theelectronic component is at least one of a memory, a processor, variouselements, a camera device, various sensor modules, and a flash device.19. The electronic device of claim 16, wherein the battery pack isarranged as an embedded power source in the electronic device.